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Result of collaboration with Fuji Kikai Kogyo Co., Ltd. who was responsible for the design and creation of a solvent-free lamination machine suited for DUALAM.
December 20, 2019
By: Anthony Locicero
Copy editor, New York Post
DIC Corporation and its subsidiary DIC Graphics Corporation announced they successfully developed an instant curing solvent-free adhesive for general purpose packaging, DUALAM. The instant curing technology is a result of collaborative innovation together with Fuji Kikai Kogyo Co., Ltd. who was responsible for the design and creation of a solvent-free lamination machine suited for DUALAM. The DIC Group is guided by DIC’s new medium-term management plan, DIC 111, which directs the group to work...
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